Electrical device

ABSTRACT

An electrical device includes a first substrate, a second substrate opposed to a first side of the first substrate, and a functional element between the first side of the first substrate and the second substrate. A first electrode is arranged to a first substrate side of the functional element and overlaps with the functional element. A second electrode is arranged to a second substrate side of the functional element and overlaps with the functional element. An electronic component is arranged between the functional element and the first electrode, overlaps the first and second electrodes, and drives the functional element. A connecting section includes a first wiring, a second wiring, a first contact hole connecting the first electrode to the first wiring, and a second contact hole connecting the first wiring to the second wiring. The first contact hole has a portion that does not overlap with the second contact hole.

CROSS-REFERENCE

The present application is a continuation application of U.S. patentapplication Ser. No. 13/402,055 filed on Feb. 22, 2012, which claimspriority from Japanese Patent Application No. 2011-045479 filed on Mar.2, 2011, which are hereby expressly incorporated by reference in theirentirety.

BACKGROUND

1. Technical Field

The present invention relates to an electrical device.

2. Related Art

In recent years, a typical configuration of a flat panel display(electrical device) such as a liquid crystal device, an organic ELdisplay device, or an electrophoretic display device is disclosed inJP-A-2007-249231 and Japanese Patent No. 4366743, a TFT active matrix isformed on an element substrate which is formed from a rigid glasssubstrate and a connection substrate (FPC) with flexibility which ismounted with a driving circuit is connected on at least one side of theelement substrate.

However, in the case of the configuration described above, since theconnection substrate with flexibility is used by being bent to the rearsurface side of the display device, the side which is connected to theconnection substrate is not able to be bent even if, for example, adisplay section is configured by a base material with flexibility. As aresult, it is not possible to have flexibility at all four sides.

SUMMARY

An advantage of some aspects of the invention is that a thin and lightelectrical device with flexibility is provided.

The present inventors have already proposed a configuration which isable to have flexibility similar to paper through electronic componentsor the like which configure a driving circuit being embedded between aplurality of base materials with flexibility. However, display defectsoccur such as, for example, a certain region not returning afterbecoming black when a display device such as this is placed on a deskand lifted up from there or the rear surface side of the display deviceis touched. This has been revealed to be due to a transistor beingbroken due to static electricity or an abnormally high voltage beingapplied to the electrophoretic material. The invention suppresses theoccurrence of defects due to static electricity such as this.

According to an aspect of the invention, an electrical device isprovided with a first substrate and a second substrate which aredisposed in an opposing manner so as to interpose a functional element,a first electrode (rear surface electrode) which is provided more to thefirst substrate side than the functional element, a second electrode(opposing electrode) which is provided on the second substrate and iselectrically connected to the first electrode, and the functionalelement and an electronic component which drives the functional elementin a region which is a region where the first substrate and the secondsubstrate overlap and which is interposed between the first electrodeand the second electrode.

According to this, since the first electrode provided on the firstsubstrate and the second electrode provided on the second substrate areelectrically connected to each other, even if a high potential isapplied to the first electrode or the second electrode, it is difficultfor the functional element or the electronic component which aredisposed therebetween to be damaged. As such, it is possible to suppressthe effect of static electricity with regard to the functional elementand the electronic component which is disposed between the firstelectrode and the second electrode.

In addition, there may be a configuration where the second electrode isa common electrode of the functional element.

According to this, even if a high potential is applied to the commonelectrode of the functional element (the second electrode) and the firstelectrode, it is difficult for the functional element or the electroniccomponent which are disposed therebetween to be damaged.

In addition, there may be a configuration where the first substrate is alaminate of a plurality of base materials and the first electrode or theelectronic component is respectively disposed on the surface of thefirst substrate or between the plurality of base materials.

According to this, by using a multi-layer substrate configuration wherethe substrate is a laminate of a plurality of base materials, withoutlimiting the number of electronic components or wiring, it is possibleto secure a space for forming these and a plurality of the electroniccomponents and wiring are able to be excellently held.

In addition, there may be a configuration where at least a portion ofthe second substrate and the second electrode are disposed so as to wraparound to the first substrate side.

According to this, it is possible to prevent the entry of staticelectricity from the side of the electrical device.

In addition, there may be a configuration where a third substrate isprovided on the rear surface of the first substrate, the first electrodeis disposed between the first substrate and the third substrate, and thefirst electrode is electrically connected with a portion of the secondelectrode via an external connection terminal which is connected to theelectronic component provided on the rear surface.

According to this, the first electrode is protected by the thirdelectrode and it is possible to prevent deterioration of the electrodesand the like. In addition, since conduction between the first electrodeand the second electrode is performed at the rear surface side of thefirst substrate, it is possible to use all of a desired functionalregion.

In addition, there may be a configuration where at least a portion ofthe second substrate and the second electrode are disposed to wraparound onto the rear surface of the first substrate and the firstelectrode is electrically connected to a portion of the second electrodevia an external connection terminal which is connected to the electroniccomponent provided on the rear surface.

According to this, since at least a portion of the second substrate andthe second electrode are disposed to wrap around onto the rear surfaceof the first substrate and conduction between the first electrode andthe second electrode is performed at the rear surface side of the firstsubstrate, it is possible to use all of a desired functional region.

In addition, there may be a configuration where the first electrode isembedded in the first substrate.

According to this, it is possible to prevent deterioration of and damageto the electrode due to the first electrode being embedded in the firstsubstrate.

In addition, there may be a configuration where the first electrode isprovided on the rear surface of the first substrate.

According to this, the configuration where the first electrode isprovided on the rear surface of the first substrate is easy to bemanufactured.

In addition, there may be a configuration where a connection sectionwhich electrically connects the first electrode and the second electrodeis formed along at least one side of the first substrate and the secondsubstrate.

According to this, due to the connection section serving the role of amoisture barrier, a moisture prevention effect is able to be obtainedwith regard to the functional layer, the electronic apparatus, and thelike and it is possible to prevent breakdowns thereof.

In addition, there may be a configuration where the connection sectionwhich electrically connects the first electrode and the second electrodeis formed in at least one corner of a region where the functionalelement which is held between the first substrate and the secondsubstrate exists.

According to this, since it is possible to obtain conduction between thefirst electrode and the second electrode in a region which includes atleast one corner portion of the region where the functional elementexists, it is possible to reliably obtain conduction between the firstelectrode and the second electrode in a smaller region.

In addition, there may be a configuration where one out of a pair ofelectrodes which interpose the functional element is the secondelectrode, the other is a plurality of third electrodes (pixelelectrodes) which are formed on a surface on the functional element sideof the first electrode, and the electronic component is connected to theplurality of third electrodes via a plurality of connection wirings.

According to this, it is possible to simultaneously drive the pluralityof third electrodes via the electronic component and it is possible toincrease the speed of rewriting a screen since writing of a plurality ofpixels which configure one screen as one block is possible. In addition,a switching element which performs a switching operation for applying avoltage with regard to the third electrode is not necessary. Due tothis, the configuration is simplified and manufacturing is easy.

In addition, there may be a configuration where the electronic componentis an electronic circuit and a protection circuit is provided betweenthe output terminal of the electronic circuit and the first electrode.

According to this, since the protection circuit is provided between theoutput terminal of the electronic component and the first electrode, ina case where a predetermined difference in potential is generatedbetween the output terminal and the first electrode, it is possible toshort between the output terminal and the first electrode and reduce thedifference in potential therebetween. Due to this, it is possible toprevent electrostatic damage to the electronic component.

In addition, the connection section may be configured from a pluralityof wiring sections which are formed on different base materials and aplurality of contact holes which are formed on different base materials,connect the plurality of wiring sections, and do not overlap in a planarview.

According to this, there is a connection section with a wave shape in across-sectional view and a moisture prevention effect is furtherincreased.

In addition, there may be a configuration where the functional elementis an electro-optical element.

According to this, it is possible to obtain an electro-optical devicewhich is able to suppress the generation of defects due to staticelectricity and reliably obtain a desired function.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention will be described with reference to the accompanyingdrawings, wherein like numbers reference like elements.

FIGS. 1A and 1B are diagrams schematically illustrating an overallconfiguration of an electrophoretic display device which is a firstembodiment of the electrical device of the invention, and FIG. 1A is across-sectional diagram along line IA-IA of FIG. 1B.

FIG. 2 is a cross-sectional diagram illustrating a specificconfiguration of an electrophoretic display device or a cross-sectionaldiagram specifically illustrating a configuration of the electrophoreticdisplay device of the embodiment.

FIG. 3 is a cross-sectional diagram illustrating a configuration of aliquid crystal display device or a cross-sectional diagram illustratingan overall configuration of the liquid crystal display device which is asecond embodiment of the electrical device of the invention.

FIG. 4 is a cross-sectional diagram illustrating a modification of thefirst embodiment according to the invention.

FIG. 5 is a planar diagram illustrating a schematic configuration of athird embodiment.

FIG. 6 is a cross-sectional diagram along a line VI-VI of FIG. 5.

FIG. 7A is a planar diagram illustrating an enlargement of a portion(5×5 pixels) of an image display region and FIG. 7B is a cross-sectionaldiagram along a line VIIB-VIIB of FIG. 7A.

FIG. 8 is a cross-sectional diagram illustrating a schematicconfiguration of an electrophoretic display device of a fourthembodiment.

FIG. 9 is a cross-sectional diagram illustrating a schematicconfiguration of an electrophoretic display device of a fifthembodiment.

FIG. 10 is a partial enlarged cross-sectional diagram illustrating indetail a configuration of the electrophoretic display device of thefifth embodiment.

FIGS. 11A to 11D are diagrams illustrating a process during folding of asheet substrate in the manufacturing of the electrophoretic displaydevice of the fifth embodiment.

FIG. 12 is a cross-sectional diagram illustrating a schematicconfiguration of an electrophoretic display device of a sixthembodiment.

FIGS. 13A to 13E are diagrams illustrating a process during folding of asheet substrate in the manufacturing of the electrophoretic displaydevice of the sixth embodiment.

FIG. 14 is a cross-sectional diagram partially illustrating aconfiguration of an electrophoretic display device of a seventhembodiment.

FIG. 15 is a diagram illustrating a modification of the electrophoreticdisplay device of the seventh embodiment.

FIG. 16 is a cross-sectional diagram illustrating a schematicconfiguration of an electrophoretic display device of an eighthembodiment.

FIGS. 17A and 17B are equivalence circuit diagrams illustrating aspecific configuration of an electrostatic protection circuit.

FIGS. 18A and 18B are equivalence circuit diagrams illustrating anotherconfiguration of an electrostatic protection circuit.

FIG. 19 is an equivalence circuit diagram illustrating still anotherconfiguration of an electrostatic protection circuit.

FIG. 20 is a cross-sectional diagram illustrating another configurationof the electrophoretic display device of the eighth embodiment.

FIGS. 21A and 21B are diagrams illustrating a schematic configuration ofa piezoelectric sensor where the configuration of the electrical deviceof the third embodiment has been applied, FIG. 21A is a planar diagram,and FIG. 21B is a cross-sectional diagram along a line XXIB-XXIB of FIG.21A.

FIGS. 22A to 22C are perspective diagrams illustrating configurations ofelectronic apparatuses.

DESCRIPTION OF EXEMPLARY EMBODIMENTS

Below, the embodiments of the invention will be described with referenceto the attached diagrams. Here, in each of the diagrams which are usedin the explanation below, the dimensions of each member areappropriately changed in order that each member be a recognizable size.

First Embodiment Electrophoretic Display Device

FIGS. 1A and 1B are diagrams schematically illustrating an overallconfiguration of an electrophoretic display device which is a firstembodiment of the electrical device of the invention, and FIG. 1A is across-sectional diagram along IA-IA of FIG. 1B. FIG. 2 is across-sectional diagram illustrating a specific configuration of anelectrophoretic display device. FIG. 3 is a cross-sectional diagramillustrating a configuration of a liquid crystal display device.

An opposing electrode 37 is a common electrode of an electrophoreticlayer 32A and is used in driving the electrophoretic layer 32A.

As shown in FIGS. 1A and 1B, an electrophoretic display device(electrical device) 100 of the embodiment is configured to be providedwith an element substrate 300 which is formed from a semiconductordevice, an opposing substrate 310 which is disposed to oppose theelement substrate 300, and an electrophoretic layer (functional element)32A which is interposed between the element substrate 300 and theopposing substrate 310 which are flexible.

A sealing material 65 is disposed so as to enclose the circumference ofthe electrophoretic layer 32A in order to secure resistance to moisturewith regard to the electrophoretic layer 32A between the peripheryportions of each of the element substrate 300 and the opposing substrate310.

In the embodiment, a rear surface electrode (first electrode) 19 whichhas a rectangular shape in a planar view is embedded in a firstsubstrate 30 which configures the element substrate 300. The rearsurface electrode 19 has a rectangular shape in a planar view and isdisposed on a rear surface side of the first substrate 30. The rearsurface electrode 19 is connected to a connection section 39, which ispositioned in four corner portions thereof and is embedded in the firstsubstrate 30, and an up and down conduction section 33, which isdisposed between the element substrate 300 and the opposing substrate310 via an up and down conduction terminal 49 which is provided on thefront surface of the first substrate 30.

The up and down conduction section 33 exists to the outer side of theelectrophoretic layer 32A and more to an inner side than the sealingmaterial 65, one edge side is connected to the up and down conductionterminal 49, and the other edge side is connected to the opposingelectrode (second electrode) 37. Due to this, there is a configurationwhere the rear surface electrode 19 and the opposing electrode 37 areelectrically connected. The opposing electrode 37 is the commonelectrode and is used in driving the electrophoretic layer 32A.

Next, the configuration of the electrophoretic display device of theembodiment will be described in a specific manner.

FIG. 2 is a cross-sectional diagram specifically illustrating aconfiguration of the electrophoretic display device of the embodiment.

As shown in FIG. 2, the element substrate 300 is mainly configured bythe first substrate 30 and a driving circuit layer 24 which is formed onthe front surface thereof and is provided with the rear surfaceelectrode 19 which is embedded in an inner portion of the firstsubstrate 30 in the embodiment.

The first substrate 30 is a laminate of six base materials 30A, 30B,30C, 30D, 30E, and 30F which have flexibility, and the rear surfaceelectrode 19, a scanning line driving Dr-IC (electronic component) 51, adata line driving Dr-IC (electronic component) which is not shown, acontroller (electronic component) CONT, various types of wiring, and thelike are embedded in the base materials 30A to 30F. The various types ofwirings (a gate connection line 66A, a connection wiring 22, and thelike) which are embedded in the first substrate 30 are configured fromCu with a thickness of 10 μm. In addition, each of the base materials30A to 30F is a flexible substrate which is formed from polyimide with athickness of 50 μm. Since a user visually recognizes the image from theopposing substrate 310 side, the first substrate 30 may be a substratewhich is not transparent.

Specifically, it is preferable that a substrate which is not transparentbe used as the base material 30B where the scanning line driving Dr-IC51, the data line driving Dr-IC, and the controller CONT which areelectronic components are embedded. Due to the imparting of a lightblocking property to the base material in the vicinity of the electroniccomponents, it is possible to suppress erroneous operations in theelectronic components due to light leaking.

The driving circuit layer 24 has a pixel element (third electrode) 35for each of a plurality of pixels disposed in a matrix formation whichconfigures an image display region 5 of the electrophoretic displaydevice 100 and a control transistors TRs which controls the pixelelectrodes 35, and the pixels are provided at each location where aplurality of scanning lines 66 and a plurality of data lines 68A and 68Bintersect. Then, out of the control transistors TRs, a portion of thescanning lines 66, which are disposed so as to oppose a channel regionof a semiconductor layer 41 a, function as a gate electrode 41 e. Thecontrol transistors TRs are organic TFTs which have a bottom gate/topcontact configuration and an organic semiconductor layer.

The driving circuit layer 24 described above is provided on the firstsubstrate 30, but the plurality of the scanning lines 66, the pluralityof the data lines 68A and 68B, and a plurality of holding capacitancelines 69 which are disposed in the image display region 5 are formed ona front surface 30 a of the first substrate 30, and furthermore, in theembodiment, the up and down conduction terminal 49 which is disposed atthe four corners of the first substrate 30 is formed in the imagedisplay region 5. These are formed from Cu with a thickness of 0.5 μm bybeing formed by patterning in the same process.

A gate insulating film 41 b is provided over the entire front surface ofthe first substrate 30 so as to cover the scanning lines 66 (gateelectrode 41 e), the plurality of holding capacitance lines 69 and theup and down conduction terminal 49. The gate insulating film 41 b isformed from polyimide with a thickness of 0.5 μm and the semiconductorlayer 41 a which is formed from pentacene with a thickness of 0.05 μm isformed thereon. A source electrode 41 c and a drain electrode 41 d whichare formed from Au with a thickness of 0.2 μm are further provided onthe gate insulating film 41 b so that a portion is on top of a peripheryportion of the semiconductor layer 41 a. The semiconductor layer 41 a,the source electrode 41 c, and the drain electrode 41 d are covered by aprotection layer 42 which is formed from acryl with a thickness of 1 μmand the pixel electrode 35 is electrically connected to a lower layer ofthe drain electrode 41 d via a contact hole H which penetrates throughthe protection layer 42 in a thickness direction. The contact hole H isformed by not depositing the protection layer 42 in the formation regionthereof. The control transistors TRs are formed by sequentially forminga thin film from the first substrate 30 side.

The data lines 68A and 68B which supply an image signal are electricallyconnected to the source electrode 41 c of the control transistors TRs.Here, the image signal which is written into the data lines 68A and 68Bmay be sequentially supplied in lines or may be supplied for each groupor for each single data line with regard to the data lines 68A and 68Bwhich are adjacent to each other.

In addition, the scanning line 66 is electrically connected in the gateelectrode 41 e of the control transistor TRs and is configured so that aselection signal (scanning signal) is applied sequentially in lines inpulses at a predetermined timing.

The pixel electrode 35 which is formed on a front surface of the firstsubstrate 30 is electrically connected to the drain electrode 41 d ofthe control transistor TRs and the image signal which is supplied fromthe data lines 68A and 68B is written in at a predetermined timing withregard to the electrophoretic layer 32A due to the control transistorTRs which is a switching element being in an open state.

The electrophoretic layer 32A has a plurality of microcapsules 20. Theplurality of microcapsules 20 are capsules with a substantiallyspherical shape where two types of electrophoretic particles of blackand white which are either charged as positive or negative (positivelycharged particles 26 and negative charged particles 27) and a dispersionmedium 21 are enclosed. The electrophoretic particles (positivelycharged particles 26 and negative charged particles 27) move to theopposing electrode 37 side or the pixel electrode 35 side due to adifference in potential in the pixel electrode 35 and the opposingelectrode 37 which is formed by a holding capacitance Cs (not shown) andthe electrophoretic layer 32A forms an image due to the distributionstate of the electrophoretic particles which are visually recognizedwhen the electrophoretic layer 32A is viewed from the opposing substrate310 side.

Here, since the image signal which is held prevents leaking, the holdingcapacitance Cs is added in parallel with a capacitance which is formedbetween the pixel electrode 35 and the opposing electrode 37. Theholding capacitance Cs is formed between the drain electrode 41 d of thecontrol transistor TRs and the holding capacitance line 69 whichsupplied a low potential.

Here, not limited to an example where electrophoretic material of acapsule type are used, for example, there may be a partition such as aseparating wall which segments a space between the first substrate 30and the second substrate 31 or there may not be a partition. Inaddition, a particle configuration other than the two black and whiteparticles which are charged with different polarities may be adopted.

The rear surface electrode 19 is electrically connected with the up anddown conduction terminal 49 on the front surface of the base material30F, that is, the front surface 30 a of the first electrode 30 via theconnection section 39 which is formed in a via which is disposed on thebase material 30A, passes through the base materials 30B to 30E, andpenetrates these in a thickness direction and via a relay terminal 39Awhich is formed by patterning in the surface of the base material 30E.

The scanning line driving Dr-IC 51 (electronic component 10) forsupplying the scanning signal, which is for driving the controltransistor TRs, to the scanning line 66, the data line driving Dr-IC(not shown: electronic component 10) which controls the circuit whichsupplies the image signal to the data lines 68A and 68B, and thecontroller CONT which controls each of the Dr-ICs are embedded betweenthe base material 30B and the base material 30C.

The output side of the scanning line driving Dr-IC 51 (output terminal51 a) is connected to the plurality of scanning lines 66 via theconnection wiring 22 and the gate connection line 66A which are embeddedin the first substrate 30 and controls the timing when the scanningsignal is supplied with regard to each of the scanning lines 66. On theother hand, the input side (input terminal 51 b) is connected to theoutput side (output terminal 1 b) of the controller CONT via theconnection wiring 22. The data line driving Dr-IC are the same.

In this manner, there is a configuration where the frame edge width,that is, a non-display region 6 is made to be narrower by the scanningline driving Dr-IC 51 and the data line driving Dr-IC being embedded inthe first substrate 30 in a range of the image display region 5 withoutbeing disposed in the periphery of the image display region 5.

In addition, the four up and down conduction sections 33 which aredescribed above are provided in the image display region 5 and the rearsurface electrode 19 on the element substrate 300 side and the opposingelectrode 37 on the opposing substrate 310 side is electricallyconnected using the four up and down conduction sections 33.

The sealing material 65 which is formed from epoxy resin is provided inthe non-display region 6 so as to fill in a gap between the elementsubstrate 300 and the opposing substrate 310 and the sealing material 65seals the periphery of the electrophoretic layer 32A.

As the up and down conduction section 33, the forming of a metal pastesuch as Ag or Cu in a predetermined shape, the holding of a materialwhere a plastic surface with a spherical shape is coated with a metal inan organic material, an anisotropic conductive film, or the like isused.

The up and down conduction section 33 is provided in the four corners ofthe image display region 5 in FIG. 1B but is not limited thereto. The upand down conduction section 33 may be provided in one or more out of thefour corners or in a thin long shape along a side.

In the opposing substrate 310, the opposing electrode 37 formed fromcarbon nanotubes with a thickness of 0.1 μm is formed on the secondsubstrate 31 which is transparent and formed from PET with a thicknessof 0.2 μm and a transparent substrate is used as the second substrate 31since the user views the electrophoretic layer 32A via the opposingsubstrate 310.

The application of a voltage to the opposing electrode 37 is performedby the controller CONT. The connection section 39 is connected in theoutput terminal 1 b of the controller CONT via the connection wiring 22.That is, there is a configuration where a predetermined voltage is inputfrom the controller CONT to the opposing electrode 37 via the connectionsection 39, the relay terminal 39A, the up and down conduction terminal49, and the up and down conduction section 33.

Due to the configuration where the rear surface electrode 19 iselectrically connected to the opposing electrode 37 in theelectrophoretic display device 100 of the embodiment, the rear surfaceelement 19 and the opposing electrode 37 are the same voltage. The rearsurface electrode 19 is formed with a size according to at least theimage display region 5 and the control transistors TRs and theelectronic component 10 are disposed in a space formed between the rearsurface electrode 19 and the opposing electrode 37. Due to theconfiguration, suppression of breakdowns due to static electricity fromthe outside is possible due to the control transistor TRs and theelectronic component 10 being shielded by the rear surface electrode 19and the opposing electrode 37 which are electrically connected to eachother. That is, it is difficult for damage to occur since a high voltageis not applied to the control transistor TRs, the electronic component10, and the like even if a high potential is applied to the opposingelectrode 37 and the rear surface electrode 19. Furthermore, there isalso a function of an EM shield for suppressing damaging electromagnetic(EM) radiation.

The four sides of the electrophoretic display device 100 are notshielded in the configuration in the embodiment since the up and downconduction section 33 is only disposed at the four corners of theelement substrate 300, but there is hardly any static electricity whichgets in from the side since the front and rear surfaces of theelectrophoretic display device 100 are shielded by the opposingelectrode 37 and the rear surface electrode 19.

In addition, as means by which a voltage is applied to the opposingelectrode 37 in the embodiment, the controller CONT is used but is notlimited thereto, and there may be a configuration where the voltage isoutput from a Dr-IC or a battery.

In addition, the sealing material 65 which is formed from epoxy resin isused in the embodiment, but an organic material such as acryl may beused.

In addition, as the charged particles, color particles other than whiteand black particles may be used and a light emitting material such as aliquid crystal material or OLED may be used as the electro-opticalelement.

In addition, the number of the up and down conduction sections 33 is notlimited to four. In addition, the shape thereof is not limited to thatdescribed above and the up and down conduction section 33 may be formedin a line shape.

Furthermore, the configuration of the control transistor TRs is notlimited to the bottom gate configuration. The control transistor TRs mayuse either an organic or inorganic transistor. In addition, thematerials which are used for the control transistor TRs, the firstsubstrate 30, the second substrate 31, or the opposing electrode 37 arenot limited to that described above.

In addition, the material which is used in the first substrate 30 whichconfigures the element substrate 300 and the second substrate 31 of theopposing substrate 310 may use polyester or another organic or inorganicmaterial which has flexibility. In addition, if it does not haveflexibility, phenol paper, epoxy paper, glass composite, glass epoxy,thin glass, Teflon (registered trademark) ceramics, a composite ofthese, or another organic or inorganic material may be used.

In addition, as the material which is used in the first substrate 30 andthe second substrate 31, there may also be a material which extends andretracts. Due to this, it is possible to realize flexibility whichincludes expansion and contraction states. For example, a soft organicmaterial such as acryl and a non-woven fabric or a woven fabric which iscoated with this, rubber, or the like may be used. When having anexpansion and contraction property, it is possible to not only disposean electro-optical device by adhering on a material with considerabledeforming such as a fabric such as clothing or on a complex surfaceshape without any gaps but it is also possible to reduce peeling due todeforming when used.

In addition, the number of base materials which configures the firstsubstrate 30 is not limited to that described above.

In addition, the material of the control transistor TRs is not limitedto that described above.

In addition, as the material which is used for the pixel electrode 35,the opposing electrode 37, the scanning line 66, the data lines 68A and68B, the connection wiring 22, and the like, a metal paste other than Cupaste, a conductive material such as metal or carbon nanotubes, aninorganic conductive material, an organic conductive material, atransparent substrate, or a conductive paste may be used.

Second Embodiment Liquid Crystal Display Device

FIG. 3 is a cross-sectional diagram illustrating an overallconfiguration of the liquid crystal display device which is a secondembodiment of the electrical device of the invention.

As shown in FIG. 3, a liquid crystal display device (electrical device)102 adopts a liquid crystal layer (functional element) 32B instead ofthe electrophoretic layer of the electrophoretic display device which isdescribed above. In the embodiment, the point that the data lines 68Aand 68B and the holding capacitance Cs are embedded in the firstsubstrate 30 and the point that the control transistor TRs is a topgate/bottom contact configuration is different from the previousembodiment. The holding capacitance Cs is configured from a holdingcapacitance line 93, a holding capacitance electrode 92, and the basematerial 30C which is held therebetween.

As shown in FIG. 3, the rear surface electrode 19, the controller CONT,the holding capacitance Cs, the data lines 68A and 68B are embedded inthe first substrate 30 of the liquid crystal display device 102. In thesource electrode 41 c of the control transistor TRs which is formed onthe front surface of the first substrate 30, the data lines 68A and 68Bwhich are disposed on the substrate 30D are electrically connected via acontact hole H1 which is formed in the base materials 30E and 30F out ofthe plurality of base materials 30A to 30F which configure the firstsubstrate 30.

The rear surface electrode 19 is disposed between the base material 30Aand the base material 30B out of the plurality of base materials 30A to30F which are laminated to configure the first substrate 30. Inaddition, in the controller CONT which is disposed on the front surfaceof the base material 30B (the surface on the side opposite to the basematerial 30A), since the output terminal 1 b is connected to theconnection section 39 via the connection wiring 22 on the base material30C, a predetermined potential is input to the opposing electrode 37from the controller CONT via the up and down conduction section 33.

Specifically, the voltage from the controller CONT is supplied to theopposing electrode 37 via the connection wiring 22, the connectionsection 39, the relay terminal 39A, the up and down conduction terminal49, and the up and down conduction section 33 and is also supplied tothe rear surface electrode 19 which is connected to an edge portion on aside opposite to an edge portion of the relay terminal 39A side of theconnection section 39. Due to this, the rear surface electrode 19 andthe opposing electrode 37 have the same potential and the space betweenthe rear surface electrode 19 and the opposing electrode 37 is shielded.

The holding capacitance Cs is configured using a pair of electrodes 10 aand 10 b which are embedded in the first substrate 30 and capacitance isaccumulated between the electrodes 10 a and 10 b. The electrode 10 bwhich is one which configures the holding capacitance Cs is electricallyconnected to the drain electrode 41 d of the control transistor TRs viaa contact hole H2 which penetrates through the base materials 30D to30F.

The gate insulating film 41 b of the embodiment is deposited with athickness of 0.4 μm so as to cover the source electrode 41 c, the drainelectrode 41 d, the semiconductor layer 41 a, which are formed so that aportion thereof is on top of the source electrode 41 c and the drainelectrode 41 d, and the relay terminal 39A which are formed on the frontsurface of the first substrate 30. Out of the semiconductor layer 41 a,the gate electrode 41 e which is formed on the gate insulating film 41 bso as to oppose the channel region is covered by the protection layer 42which is formed on the gate insulating film 41 b and configures thecontrol transistor TRs.

The pixel electrode 35 which is disposed on the protection layer 42 iselectrically connected to the drain electrode 41 d of the controltransistor TRs via a contact hole H3 which penetrates the protectionlayer 42 and the gate insulating film 41 b in the thickness direction.Due to this, image display is performed by the image signal from thedata lines 68A and 68B being supplied to the liquid crystal layer 32Bvia the control transistor TRs.

As the liquid crystals which configure the liquid crystal layer(functional layer) 32B, liquid crystals where optical characteristicshardly depend on a cell gap d such as guest host liquid crystals, PDLC(polymer dispersed liquid crystals), PNLC (polymer network liquidcrystals), or IPS liquid crystals are appropriate. This is because, in acase where flexible substrates are used as the first substrate 30 whichconfigures the element substrate 300 and the second substrate 31 whichconfigures the opposing substrate 310, the cell gap d changes when theliquid crystal display device 102 is bent. As a result, it is desirableto use the liquid crystal material described above, but liquid crystalmaterials other than these are not problematic.

Here, in a case where the liquid crystal material is used, it isdesirable that a volatile memory such as an SRAM is provided for eachpixel since the liquid crystal material itself does not have memorycharacteristics.

Also with regard to the liquid crystal display device 102 of theembodiment, suppression of breakdowns due to static electricity from theoutside is possible due to the control transistor TRs and the electroniccomponent 10 being shielded by the rear surface electrode 19 and theopposing electrode 37 in the same manner of the previous electrophoreticdisplay device 100. Accordingly, it is difficult for damage to occursince a high potential is not applied to the control transistor TRs, theelectronic component 10, and the like even if a high voltage is appliedto the opposing electrode 37 and a high quality display device is ableto be obtained.

Modification

FIG. 4 is a cross-sectional diagram illustrating a modification of thefirst embodiment according to the invention. Here, an example is shownin FIG. 4 where the electrophoretic layer is shown, but the modificationmay also be applied to the liquid crystal display device of the secondembodiment which uses the liquid crystal layer.

As shown in FIG. 4, there may be a configuration where the rear surfaceelectrode 19 is provided directly on a rear surface 30 b of the firstsubstrate 30 which configures the element substrate 300 and the rearsurface element 19 is exposed from the first substrate 30.

In this manner, even if there is a configuration where the rear surfaceelectrode 19 is exposed from the first substrate 30, it is possible toobtain a static electricity shielding effect with regard to the controltransistor TRs and the electronic component 10 due to the rear surfaceelectrode 19 and the opposing electrode 37. If there is thisconfiguration, manufacturing is easily performed.

Here, there may be a configuration where the rear surface electrode 19is not exposed as is but the rear surface electrode 19 is protected by atransparent insulating sheet or the like wrapping the entirety thereof.

Third Embodiment

FIG. 5 is a planar diagram illustrating a schematic configuration of athird embodiment and FIG. 6 is a cross-sectional diagram along a lineVI-VI of FIG. 5. FIG. 7A is a planar diagram illustrating an enlargementof a portion (5×5 pixels) of an image display region and FIG. 7B is across-sectional diagram along a line VIIB-VIIB of FIG. 7A.

As shown in FIGS. 5 and 6, in an electrophoretic device (electricaldevice) 103 of the embodiment, a plurality of driving drivers ICs 85,which directly drive the plurality of pixel electrodes 35 which aredisposed in a matrix formation in the image display region 5, areembedded in the first substrate 30 instead of the control transistorsTRs.

The element substrate 300 and the opposing substrate 310 which areformed from the first substrate 30 and the second substrate 31 whichhave flexibility are substantially the same shape and size and theelectrophoretic layer 32A is interposed therebetween to form the imagedisplay region 5. In addition, an electronic circuit 11 which drives theplurality of driving driver ICs 85 which are embedded in the firstsubstrate 30 is disposed in a region on the outer side of the imagedisplay region 5. The controller CONT is included in the electroniccomponent 10.

In the embodiment, as shown in FIGS. 7A and 7B, a predetermined numberof the driving driver ICs (electronic components) 85, which are arrangedat equal intervals to correspond to each of a plurality of pixels 40,are embedded in an inner portion of the first substrate 30 whichconfigures the element substrate 300. The driving driver ICs 85 aredisposed in a matrix formation of m×n to correspond to the arrangementof the pixels 40 and are formed so as to be able to individually driveeach of the pixels. The number of pixels which are able to be displayedin the embodiment is, for example, 100×100. The driving driver IC 85 hasa plurality of output terminals 85 a (refer to FIGS. 7A and 7B) whichcorrespond to the 100×100 matrix pixels on a surface thereof. The outputterminal 85 a of the driving driver IC 85 is directly connected to thepixel electrode 35 which is formed on the front surface 30 a of thefirst substrate 30 using the connection wiring 22 which is formed in aninner portion of the first substrate 30. In this manner, by the drivingdriver IC 85 (the output terminal 85 a) and the pixel electrode 35 beingeach directly connected using the connection wiring 22 without going viaa control transistor or the like, it is possible to directly drive thepixel electrode 35.

Each of the driving driver ICs 85 are controlled based on a signal whichis input from the electronic circuit 11 which is formed from a pluralityof electronic components 10 which are mounted on the first substrate 30and rewriting of a screen is executed by performing a block writingoperation where the application of a voltage is performed with theplurality of pixel electrodes 35 as a block or a sequential writingoperation where the writing of a sequential voltage is performed withregard to the plurality of pixel electrodes 35. Here, it is possible toreduce the time which is necessary for switching screens by the blockwriting operation being executed with regard to the plurality of pixelelectrodes 35.

In addition, although not shown in the diagram, wiring which connectsthe driving driver IC 85 and the electronic circuit 11 is also embeddedin a predetermined position in the same manner.

According to the embodiment, it is possible for the plurality of pixelelectrodes 35 to be simultaneously driven via the driving driver IC 85.As a result, it is possible to perform block writing with regard to theplurality of pixel which configure one screen and it is possible toincrease the speed of rewriting the screen. In addition, a switchingelement which performs a switching operation for applying a voltage withregard to the pixel electrode 35 is not necessary. Due to this, areduction in size is realized and manufacturing is easy due to thesimplification of the configuration.

Fourth Embodiment

FIG. 8 is a partial cross-sectional diagram illustrating a schematicconfiguration of an electrophoretic display device of a fourthembodiment.

As shown in FIG. 8, in the electrophoretic display device 104 of theembodiment, the electrophoretic layer (functional element) 32C is formedwith no partition between the element substrate 300 and the opposingsubstrate 310. In the previous embodiment, the electrophoretic layerwhich uses microcapsules is adopted, but in the electrophoretic layer32C in the embodiment, the positively charged particles 26, thenegatively charged particles 27, and the dispersion medium 21 areenclosed in a sealed space which is formed by the element substrate 300,the opposing substrate 310, and the sealing material 65 which isprovided in a periphery portion thereof.

In addition, the driving driver IC 85 for directly driving the pluralityof pixel electrodes 35 is embedded in the first substrate 30. There maybe a configuration where the driving driver IC 85 is controlled by thecontroller CONT which is embedded in the first substrate 30.

The output side of the controller CONT is connected to the rear surfaceelectrode 19 via the connection wiring 22 and a predetermined voltage isinput into the rear surface electrode 19.

Typically, the characteristics of the electrophoretic material changesdue to moisture. As a result, a moisture prevention configuration whichsuppresses the entry of water is necessary.

Therefore, a moisture barrier 55 is provided in the embodiment over allof the four sides of the first substrate 30 in a periphery portion ofthe element substrate 300 which corresponds to the non-display region.The moisture barrier 55 is formed using a metallic material such as Cu.Here, the formation material of the moisture barrier 55 is not limitedto Cu.

The moisture barrier 55 is configured so as to be a wave shape in across-sectional view by using a connection wiring for connecting therear surface electrode 19 and the opposing electrode 37 which isconnected via the up and down conduction section 33. Specifically,wiring sections 55A which are disposed between the base materials 30A to30E are disposed alternately so as not to match in a planar view inadjacent substrates and are connected using connection sections 55Bwhich penetrate each of the base materials in the thickness direction.The moisture prevention with regard to the electrophoretic layer 32C,the controller CONT, and the driving driver IC 85 is increased. Due tothis, it is possible to prevent breakage of each of the constituentelements and generation of defects.

Furthermore, a shield space which is surrounded by the rear surfaceelectrode 19, the moisture barrier 55, the up and down conductionsection 33, and the opposing electrode 37 is also formed and there is aconfiguration where there is a further increase in the effect wherebreakage due to the entry of static electricity from the outside withregard to the controller CONT, the driving driver IC 85, and theelectrophoretic layer 32C which are disposed in the shield space issuppressed. Since the moisture barrier 55 is formed over all of the foursides of the first substrate 30, it is possible to prevent the entry ofstatic electricity from the edges of the four sides of the elementsubstrate 300.

In addition, since the four up and down conduction sections 33 which areformed from metal which is disposed between the element substrate 300and the opposing substrate 310 is disposed only in the four corners ofthe display region, the sealing material 65 is disposed so as to fill inbetween the up and down conduction sections 33.

Here, the moisture barrier 55 is provided at least along one side of thefirst substrate 30 and is preferably provided along all four sides, andas a result, a high moisture prevention effect can be obtained.

Fifth Embodiment No Rear Surface Electrode

FIG. 9 is a cross-sectional diagram illustrating a schematicconfiguration of an electrophoretic display device of a fifthembodiment. FIG. 10 is a partial enlarged cross-sectional diagramillustrating in detail a configuration of the electrophoretic displaydevice of the fifth embodiment.

As shown in FIGS. 9 and 10, the electrophoretic display device 105 ofthe embodiment has the element substrate 300 and a sheet substrate 410which is configured so as to wrap around the periphery of the entireelectrophoretic layer 32A which is disposed on the surface thereof. Thesheet substrate 410 has an area which is larger than the elementsubstrate 300 and is configured by a third substrate 34 which is formedfrom a PET substrate which is soft and a sheet electrode 47 which isformed on an inner surface of the third substrate 34 (theelectrophoretic layer 32A side), and periphery edge portions 410 a (allof the four sides of the sheet substrate 410) are disposed on a rearsurface 300 b by being folded more to the element substrate 300 sidethan the electrophoretic layer 32A from the softness thereof. The rearsurface 300 b of the element substrate 300 is a state which is entirelycovered due to the sheet substrate 410 and the periphery edge portions410 a of the sheet substrate 410, which is disposed so as to belaminated with each other on the rear surface 300 b of the elementsubstrate 300, are enclosed using a sealing material 67 which has aninsulation property. In addition, here, the sheet electrode 47 functionsas the opposing electrode.

Here, all of the periphery edge portions 410 a of the sheet substrate410, that is, the four sides, may not be disposed on the rear surface300 b of the element substrate 300 and only one side or two or moresides may be disposed thereon.

An external connection terminal 53 (FIG. 10), which is connected to theoutput terminal 1 b of the controller CONT which is embedded in thefirst substrate 30, is exposed in the rear surface 300 b of the elementsubstrate 300 and is electrically connected to the sheet electrode 47 ofthe sheet substrate 410 which is disposed on the rear surface 300 b sideof the element substrate 300 via a conduction section 52 which isprovided in the sealing material 65 which connects the element substrate300 and the sheet substrate 410.

That is, in the embodiment, a portion of the sheet electrode 47 which isdisposed on the rear surface 300 b side of the element substrate 300functions as a rear surface electrode in each of the embodimentsdescribed above.

FIGS. 11A to 11D are diagrams illustrating a process during folding ofthe sheet substrate in the manufacturing of the electrophoretic displaydevice of the fifth embodiment.

As shown in FIG. 11A, the element substrate 300 and the sheet substrate(second substrate) 410 which have different areas are prepared and theelement substrate 300 is placed in the center portion of the sheetsubstrate 410. Here, the sheet substrate 410 is prepared so that theelectrophoretic layer 32A is provided in advance in a predeterminedregion which corresponds to the image display region 5 on the sheetelectrode (second electrode) 47. Or, the electrophoretic layer 32A maybe provided in advance on the element substrate 300 side beforeadherence.

Then, after one edge portion 410A in the long-side direction of thesheet substrate 410 is folded onto the rear surface 300 b of the elementsubstrate 300 (FIG. 11B), another edge portion 410B is folded so as tooverlap with the edge portion 410A (FIG. 11C). After this, both edgeportions 410C in the short-side direction of the element substrate 300are folded onto the rear surface 300 b of the element substrate 300. Inthis manner, all of the four sides of the sheet substrate 410 are foldedonto the rear surface 300 b side of the element substrate 300.

There is a configuration in the embodiment where all of the four sidesof the sheet substrate 410 are disposed on the rear surface 300 b of theelement substrate 300 and there is conductance between the controllerCONT and the sheet electrode 47 on the rear surface 300 b. In thismanner, by there being a configuration where the electrical connectionof the controller CONT and the sheet electrode 47 are performed onlyusing the conduction section 52 and not via the rear surface electrode,a larger shield effect is able to be obtained with regard to theplurality of electronic components which are embedded in the firstsubstrate 30, for example, the Dr-IC for driving the pixels (thescanning line driving Dr-IC 51 and the data line driving Dr-IC), thecontroller CONT, and the electrophoretic layer 32A since the fixing ofthe potential which is applied to the electrophoretic layer 32A isreliably performed.

In addition, since there is a configuration where the controller CONTand the sheet electrode 47 which are embedded in the first substrate 30are electrically connected on the rear surface 300 b of the elementsubstrate 300, it is possible to obtain conductance over the wholeregion which includes the corner portions of the image display region 5.

Since the up and down conduction sections 33 are disposed in the cornerportions of the image display region between the element substrate 300and the sheet substrate 410 in the previous embodiment, it is notpossible to perform image display in the corner portions, but accordingto the configuration of the embodiment described above, it is possibleto display a predetermined image over the entire image display region 5since the up and down conduction section 33 is on the rear surface.

In addition, it is possible to prevent the edge portions of the sheetelectrode 47 from being exposed and prevent the deterioration of thesheet electrode 47 by the periphery edge portion 410 a of the sheetsubstrate 410 being sealed by the sealing material 67. In addition,since the sealing material 67 is provided so as to cover the sidesurface of the sheet substrate 410, there is a configuration where theentry of water is prevented from a boundary with a portion of theperiphery edge portion 410 a which is laminated on the outermost sideout of the periphery edge portions 410 a of the sheet substrate 410which are folded.

As the sealing material 67, a material which is the same as the sealingmaterial such as epoxy or the like is used. Without being limited tothis, other insulation materials may be used.

Here, it is not limited to using PET as the sheet substrate 410 as longas it is a flexible and transparent material. An organic material suchas polyethylene, acryl, transparent polyimide may be used.

Sixth Embodiment

FIG. 12 is a cross-sectional diagram illustrating a schematicconfiguration of an electrophoretic display device of a sixthembodiment. FIGS. 13A to 13E are diagrams illustrating a process duringfolding of the sheet substrate in the manufacturing of theelectrophoretic display device of the sixth embodiment.

As shown in FIG. 12, the electrophoretic display device 106 of theembodiment has the element substrate 300 and a sheet substrate 420 withflexibility which has an area larger than the element substrate 300 andis configured to be provided with a protection substrate (thirdsubstrate) 430 which is disposed on the rear surface 300 b side of theelement substrate 300.

The sheet substrate 420 is disposed on a rear surface 430 b of theprotection substrate 430 by each side of all (four sides) of entireperiphery edge portions 420 a being sequentially folded onto the rearsurface 300 b side of the element substrate 300 as shown in FIGS. 13A to13E. On the rear surface 300 b side of the element substrate 300, theperiphery edge portion 420 a on the sheet substrate 420 side is disposedso as to overlap with a periphery edge portion of the protectionsubstrate 430 and a center portion of the protection substrate 430 is astate of being exposed.

An electrode (first electrode) 43, which is provided at an inner surfaceside of the protection substrate 430, is connected to an output terminalof a controller which is embedded in the first substrate 30 and iselectrically connected via the external connection terminal 53 and theconduction portion 52 which are provided on the rear surface 300 b ofthe element substrate 300. Due to this, there is a configuration wherethe sheet electrode 47 of the sheet substrate 420 and the electrode 43of the protection substrate 430 are electrically connected and the samepotential is input to the sheet electrode 47 and the electrode 43 usingthe controller CONT in the first substrate 30.

In the manufacturing of the electrophoretic display device 106 of theembodiment, the element substrate 300 and the sheet substrate 420 whichhas an area larger than the element substrate 300 are prepared, andafter the element substrate 300 is placed in the center portion of thesheet substrate 420 (FIG. 13A), the protection substrate 430 is disposedon the rear surface 300 b thereof (FIG. 13B). After this, the peripheryedge portions 420 a of the sheet substrate 420 are sequentially foldedalong each side of the element substrate 300 as shown in FIG. 13C toFIG. 13E.

Seventh Embodiment

FIG. 14 is a cross-sectional diagram partially illustrating aconfiguration of an electrophoretic display device of a seventhembodiment.

In an electrophoretic display device 107 of the embodiment, a battery 56for supplying electric power to the controller CONT is embedded in aninner portion of the first substrate 30. An external connection terminal57, which is in the same layer as the rear surface electrode 19 with nogaps, is connected to the battery 56. The external connection terminal57 is disposed in a through hole 19A in the rear surface electrode 19which is formed so as to partially overlap with the battery 56 in theplanar view and is in a state of being exposed to the outside from athrough hole 29 in the base material 30A which is positioned on theoutermost side which configures the first substrate 30.

As the battery 56, a battery with a configuration where damage due tostatic electricity is difficult is adopted.

The electrophoretic display device 107 of the embodiment is providedwith the battery 56 and a process for separately manufacturing theexternal connection terminal 57 is not necessary since the externalconnection terminal 57 for charging the battery 56 is formed in the sameprocess of the rear surface electrode 19. Due to this, the manufacturingis easy but it is easy for static electricity to have an effect withoutthe external connection terminal 57 being shielded by the rear surfaceelectrode 19 due to the external connection terminal 57 being providedin a region where the rear surface electrode 19 does not exists. As aresult, there is a configuration where it is difficult for staticelectricity to enter an inner portion since the external connectionterminal 57 and the rear surface electrode 19 are prevented from beingin direct connection with other members due to the rear surfaceelectrode 19 and the external connection terminal 57 being formedbetween the base material 30A and the base material 30B and disposedmore to the inner side than the rear surface 300 b without being formedon the rear surface of the first substrate 30 (the rear surface 300 b ofthe element substrate 300).

For example, static electricity is generated due to separation chargewhich is generated when an object and an object come into contact andthere is separation. In addition, static electricity is also generateddue to frictional charge which is generated when objects are in contact.As a result, it is possible to suppress the generation of staticelectricity which is caused by separation charge and frictional chargedue to the rear surface electrode 19 and the external connectionterminal 57 being provided in an inner portion of the first substrate30.

FIG. 15 is a diagram illustrating a modification of the electrophoreticdisplay device of the seventh embodiment.

As shown in FIG. 15, the point that the element substrate 300 isconfigured by seven substrates and the external connection terminal 57which is connected to the battery 56 and the rear surface electrode 19are formed in different layers is different to the previous embodiment.

In the modification, one more base material 30G is provided on the rearsurface side of the base material 30A and the external connectionterminal 57 is formed between the base material 30G and the basematerial 30A. The external connection terminal 57 is in a state of beingexposed to the outside from the through hole 29 in the base material 30Gwhich is positioned on the outermost side which configures the firstsubstrate 30.

Furthermore, a small through hole 19B is formed in the rear surfaceelectrode 19 with a smaller opening area than the through hole 19A ofthe embodiment described above and the shield effect is large since itis possible to further prevent the entry of static electricity byreducing the opening region of the base material.

Furthermore, a shielding section 58, which surrounds the periphery ofthe battery 56 by being extended from the rear surface electrode 19, isprovided in the embodiment. By the shielding section 58 being configuredusing a shield wiring 59 which is provided on a front surface of thebase material 30C which is at an upper layer side of the battery 56 andexists above the battery 56 and the contact hole H2 which is formed bypenetrating the base materials 30B and 30C which exist between the rearsurface electrode 19, it is possible to reduce the effect due to staticelectricity, which has entered from the external connection terminal 57side, with regard to the driving circuit layer 24 (the controltransistor TRs).

In addition, it is possible to use the rear surface electrode 19 as theholding capacitance line 93 in the embodiment and modification above.

FIG. 16 is a cross-sectional diagram illustrating a schematicconfiguration of an electrophoretic display device of an eighthembodiment.

As shown in FIG. 16, electrostatic protection circuits 72 and 73 areprovided in the embodiment between the external connection terminal 57and the rear surface electrode 19 which are connected to the electroniccomponent 10 such as the battery and the like.

Two common wirings of a high potential line (Vdd) 90 and a low potentialline (Vss) 91 which are used by the element substrate 300 are providedand the electrostatic protection circuits 72 and 73 are provided withregard to the common wirings. Specifically, there is a configurationwhere the rear surface electrode 19 and the external connection terminal57 which is to be protected are provided via the electrostaticprotection circuits 72 and 73 between the high potential line Vdd andthe low potential line Vss. It is preferable that the high potentialline Vdd and the low potential line Vss be formed with a formation areawith as wide a range as possible in the element substrate 300 (the firstsubstrate 30), but this is not necessarily necessary and may be formedin a one wiring state.

The external connection terminal 57 and the rear surface electrode 19which are connected to the electronic component 10 are connected via aplurality of electrostatic protection circuits 72A, 73A, 72B, and 73B inthe embodiment. Specifically, the external connection terminal 57 andthe rear surface electrode 19 are connected via the electrostaticprotection circuits 72A and 73A which are connected to the highpotential line (Vdd) 90 and are connected via the electrostaticprotection circuits 72B and 73B which are connected to the low potentialline (Vss) 91.

The electrostatic protection circuits 72 and 73 have a nonlinear form inboth directions in terms of current and voltage characteristics, are inan open state when a high voltage is applied or when a low voltage isapplied, and a surge voltage which causes static electricity and thelike flows to the common wirings. That is, the electrostatic protectioncircuits 72 and 73 are configured so that an electric current flowsbetween the external connection terminal 57 and the rear surfaceelectrode 19 in a case where a predetermined difference in potential isgenerated between the external connection terminal 57 and the rearsurface electrode 19.

For example, when the potential of the rear surface electrode 19 (theexternal connection terminal 57) becomes a potential which is equal toor more than Vdd and equal to or less than Vss, protection diodes D1 ofeach of the electrostatic protection circuits 72 (72A and 72B) and 73(73A and 73B) conduct and it is possible for static electricity to bedischarged by an electric current flowing from the external connectionterminal 57 or the rear surface electrode 19 to the common wiring (thehigh potential line (Vdd) 90 or the low potential line (Vss) 91). Inthis manner, the electronic component 10 which is embedded in the firstsubstrate 30 is protected from static electricity and electrostaticdamage is prevented. Here, it is not necessarily necessary for the twocommon wirings to be Vdd and Vss.

Here, the electronic component 10 is provided as means for inputtingdata which is displayed from the outside by being provided forperforming the exchange of signals from the outside. Alternatively, forthe purpose other than that of the electro-optical device, for example,there may be a use as means for outputting detection data using a sensoror the like.

FIG. 17A is an equivalent circuit diagram of the electrostaticprotection circuit when a power source of the electrophoretic displaydevice is in an ON state.

As shown in FIG. 17A, when the power source of the electrophoreticdisplay device is in the ON state, one of the protection diodes D1 outof the two protection diodes D1 and D2 which configure the electrostaticprotection circuit 72A and 72B conducts and the other protection diodeD2 does not conduct. Here, for example, due to unnecessary voltage beingapplied from the outside, when the rear surface electrode 19 is apotential which is equal to or more than the high potential line Vdd andis equal to or less than the low potential line Vss, the protectiondiode D1 of the electrostatic protection circuits 72A and 72B conductsand the potential which is applied to the external connection circuit 57escapes to the common wiring (the high potential line (Vdd) 90 or thelow potential line (Vss) 91) and electrostatic damage to the electroniccomponent 10 is prevented.

FIG. 17B is an equivalent circuit diagram of the electrostaticprotection circuit when the power source of the electrophoretic displaydevice is in an OFF state.

As shown in FIG. 17B, when the electrophoretic display device is in anon-operational state and the power source is in the OFF state, there isa configuration where the high potential line Vdd and the low potentialline Vss are open and the protection diode D2 of each of theelectrostatic protection circuits 72A, 72B, 73A, and 73B which are in anon-conduction state are connected to the common wiring (the highpotential line (Vdd) 90 or the low potential line (Vss) 91). It ispossible to perform the conducting of the protection diode D2 in thenon-conduction state by, for example, turning off a transistor which isnormally on. When in this state, the external connection terminal 57which is to be protected and the rear surface electrode 19 are connectedby a ring diode which is configured by the diodes D1 and D2. As aresult, the difference in potential between the rear surface electrode19 and the external connection terminal 57 does not become equal to ormore than the total of threshold voltages Vth of the two diodes D1 andD2.

According to the embodiment, using the electrostatic protection circuit72A, 72B, 73A, and 73B which are provided between the rear surfaceelectrode 19 and the external connection terminal 57, an electriccurrent flows from the rear surface electrode 19 or the externalconnection terminal 57 to the common wiring (the high potential line(Vdd) 90 or the low potential line (Vss) 91) and discharging is possiblein a case of application of a voltage which is equal to or more than apredetermined voltage to the external connection terminal 57.

Due to the introduction of the configuration such as this, it ispossible to disperse charge without damage to the electronic componenteven in a case where a charge is input to the external connectionterminal 57 due to static electricity.

In the embodiment, there is a configuration where the electrostaticprotection circuit is embedded in the first substrate 30 as anindependent circuit separate to the electronic component which is to beprotected, but may be directly built into the electronic component.

FIGS. 18A to 19 are diagrams illustrating another configuration of theelectrostatic protection circuit.

As shown in FIGS. 18A and 18B, there may be an electrostatic protectioncircuit which is configured so that a switching element T is providedinstead of the protection diode D2 described above and the rear surfaceelectrode 19 and the external connection terminal 57 short when thepower source of the electrophoretic display device is in an OFF state.

As shown in FIG. 19, the rear surface electrode 19 and the externalconnection terminal 57 may be connected via an electrostatic protectioncircuit which is formed from a multi-step ring diode 76. Here, thedifference in voltage between the rear surface electrode 19 and theexternal connection terminal 57 is reduced by the protection diode Dconducting when a difference in voltage which is equal to or larger thana voltage, which is obtained by multiplying the threshold voltage Vth ofone protection diode D and the number of steps n, is applied to bothterminals of the protection diode D. In this case, as shown in FIG. 20,there is a configuration where the rear surface electrode 19 and theexternal connection terminal 57 are connected via the electrostaticprotection circuit 78.

In the embodiment shown previously, it is preferable that there be nodifference in potential between the rear surface electrode 19 and theopposing electrode 37, but there may be a configuration where thedifference is constant even if there is a slight difference inpotential.

Other Application of Electrical Device

FIGS. 21A and 21B are diagrams illustrating a schematic configuration ofa detection element used in a piezoelectric sensor where theconfiguration of the electrical device of the third embodiment has beenapplied, FIG. 21A is a planar diagram, and FIG. 21B is a cross-sectionaldiagram along a line XXIB-XXIB of FIG. 21A.

The piezoelectric sensor is configured to be provided with one or aplurality of detection elements 702 where a piezoelectric layer(functional element) 74 is provided between an element substrate 700 andan opposing substrate 710. As the element substrate 700 and the opposingsubstrate 710 of the detection element 702, it is possible to adopt eachof the configurations of the element substrate and the opposingsubstrate in the same manner as the electrophoretic display device ofthe third embodiment described above.

Specifically, the opposing substrate 710 of the embodiment is configuredto have a protection substrate 71 which is formed from PET with athickness of 0.2 μm and a conducting film 77 which is formed from carbonnanotubes which are provided on a surface on the piezoelectric layer 74side of the protection substrate 71 and is able to bend in the samemanner as the element substrate 700. In addition, the piezoelectriclayer 74 is formed from a copolymer of trifluoroethylene and vinylidenefluoride with a thickness of 1 μm.

Then, when pressure is applied from the outside with regard to thepiezoelectric sensor, in each of the detection elements 702, whether ornot an object has come into contact with regard to the piezoelectricsensor is determined due to detection of a change in voltage which isinduced between a plurality of detection electrodes (not shown), whichare provided on the element substrate 700 instead of the plurality ofpixel electrodes described above, and the conducting film 77 of theopposing substrate 710.

Here, as the element substrate 700, it is possible to adopt theconfiguration of either of the element substrates out of the embodimentsdescribed above in the same manner.

In addition, the piezoelectric layer 74, the conducting film 77, and theprotection substrate 71 may use other organic or inorganic materialswithout being limited to the material described above. There is aconfiguration where materials are used in the same manner as each of theembodiments described above in a sealing material 75 which is disposedon periphery edge portions of the element substrate 700 and the opposingsubstrate 710 and surrounds the periphery of the piezoelectric layer 74.In addition, there may be a configuration where an electric currentwhich is supplied to the detection electrode and the conducting film 77is detected.

The piezoelectric sensor has a film form which has abundant flexibilitylike paper and detects pressure distribution and the like when, forexample, a person sits down on a chair. In addition, when the pluralityof base materials which configure the element substrate 700 isconfigured by a material which has flexibility or expansion andcontraction properties, it is possible to track complex deformations anddetect an accurate value.

In addition, the output of the detection value is performed by an outputelectrode which is formed on the front and rear surfaces of thedetection element 702 while performed using a communication functionalelement (an antenna and an IC which performs communication) which isembedded in the element substrate 700. The charging of the battery whichis embedded in an inner portion of the element substrate 700 and theinput and output of other signals is the same.

In addition, if a pyroelectric material is used instead of apiezoelectric material, a configuration of a two-dimensional temperaturesensor is possible, and if a photoelectric conversion material is used,it is possible to configure a two-dimensional light sensor, a terahertzsensor, or an X-ray sensor. Furthermore, it is possible to be applied toother electrical apparatuses.

In addition, it is possible to improve the moisture resistance capacityor the like in the embodiments and the modifications described above bywrapping the entire device with a transparent insulating sheet or thelike.

In addition, it is not necessary for the up and down conduction section33 to be at an inner side of the sealing material 65 and the up and downconduction section 33 may be disposed at an outer side.

For example, the preferred embodiments of the invention have beendescribed while referencing the attached diagrams, but it is needless tosay that the invention is not limited to these examples. It is to beclear to those skilled in the art that various modifications andalterations are possible within the range of the technical concept whichis described in the scope of the claims and it is to be understood thatthese modifications and alterations belong to the technical scope of theinvention.

For example, as the shape of the rear surface electrode 19, a shape withno gaps may be formed along the planar surface shape of the elementsubstrate 300 as in the embodiments described previously, but the shapeis not limited to this and may be configured as a mesh shape or a stripshape.

Electronic Apparatus

Next, a case where the electrophoretic display device of each of theembodiments described above is applied to electronic apparatuses will bedescribed.

FIGS. 22A to 22C are perspective diagrams illustrating specificconfigurations of electronic apparatuses where the electrophoreticdisplay device of the embodiment has been applied.

FIG. 22A is a perspective diagram illustrating an electronic book whichis one example of the electronic apparatus. An electronic book (theelectronic apparatus) 1000 is provided with a frame 1001 with a bookshape, a cover 1002 (able to be opened and closed) provided to freelyrotate with regard to the frame 1001, an operation section 1003, and adisplay section 1004 which is configured using the electrophoreticdisplay device of the invention.

FIG. 22B is a perspective diagram illustrating a wrist watch which isone example of the electronic apparatus. A wrist watch (the electronicapparatus) 1100 is provided with a display section 1101 which isconfigured using the electrophoretic display device of the invention.

FIG. 22C is a perspective diagram illustrating an electronic paper whichis an example of the electronic apparatus. An electronic paper (theelectronic apparatus) 1200 is provided with a body section 1201 which isconfigured using a rewriteable sheet having the same feeling andflexibility as paper and a display section 1202 which is configuredusing the electrophoretic display device of the invention.

For example, since it is supposed that a purpose of the electronic bookand the electronic paper and the like is to have characters repeatedlywritten onto a white background, it is necessary to remove residualimages when erasing and residual images over time.

Here, the range of electronic apparatuses to which the electrophoreticdisplay device of the invention can be applied is not limited to theseand broadly includes apparatuses which use a visual change in color tonewhich accompanies the movement of charged particles.

According to the electronic book 1000, the wrist watch 1100 and theelectronic paper 1200 above, since the electrophoretic display deviceaccording to the invention is adopted, there is a high qualityelectronic apparatus with superior reliability which performs displaywhich is close to bright full color with excellent visual recognition.

Here, the electronic apparatuses described above exemplify theelectronic apparatus according to the invention and do not limit thetechnical scope of the invention. For example, it is possible toappropriately use the electrophoretic display device according to theinvention also in display sections of electronic apparatuses such as amobile phone or a portable audio device and as electronic paper such aswork sheets such as a manual, educational documents, exercise books, andinformation sheets.

The entire disclosure of Japanese Patent Application No. 2011-045479,filed Mar. 2, 2011 is expressly incorporated by reference herein.

What is claimed is:
 1. An electrical device comprising: a firstsubstrate having a first side and a second side, the first side beingopposed to the second side; a second substrate opposed to the first sideof the first substrate; a functional element arranged between the firstside of the first substrate and the second substrate; a first electrodearranged to a first substrate side of the functional element, the firstelectrode overlapping with the functional element in a planar view; asecond electrode arranged to a second substrate side of the functionalelement, the second electrode overlapping with the functional element inthe planar view; an electronic component arranged between the functionalelement and the first electrode, the electronic component overlappingwith the first electrode and the second electrode in the planar view,the electronic component driving the functional element; and aconnecting section electrically connecting the first electrode to thesecond electrode, the connecting section comprising: a first wiringarranged between the first electrode and the functional element, asecond wiring arranged between the first wiring and the functionalelement, a first contact hole connecting the first electrode to thefirst wiring, and a second contact hole connecting the first wiring tothe second wiring, the first contact hole having a portion that does notoverlap with the second contact hole in the planar view.
 2. Theelectrical device according to claim 1, wherein the connecting sectionis provided at least along one side of the first substrate.
 3. Theelectrical device according to claim 1, wherein the first wiring, thesecond wiring, the first contact hole, and the second contact hole eachare provided at least along one side of the first substrate.
 4. Theelectrical device according to claim 1, wherein at least a part of theconnecting section is embedded in the first substrate.
 5. The electricaldevice according to claim 1, wherein: the first substrate comprises afirst base material and a second base material, the second base materialis arranged between the first base material and the functional element,and the first contact hole is formed in the first base material, thesecond contact hole is formed in the second base material, and the firstwiring is provided between the first base material and the second basematerial.
 6. The electrical device according to claim 1, wherein thefirst substrate comprises base materials which have a flexibility. 7.The electrical device according to claim 1, further comprising: a thirdelectrode arranged between the functional element and the second side ofthe first substrate, wherein the functional element is anelectro-optical element, and an optical state of the electro-opticalelement depends on a voltage between the second electrode and the thirdelectrode.
 8. The electrical device according to claim 1, wherein theconnecting section is not overlapping with the functional element in theplanar view.
 9. An electrical device comprising: a first substratehaving a first side and a second side, the first side being opposed tothe second side, a second substrate opposed to the first side of thefirst substrate, a functional element arranged between the first side ofthe first substrate and the second substrate, a first electrode arrangedto a first substrate side of the functional element, the first electrodeoverlapping with the functional element in a planar view, a secondelectrode arranged to a second substrate side of the functional element,the second electrode overlapping with the functional element in theplanar view, an electronic component arranged between the functionalelement and the first electrode, the electronic component overlappingwith the first electrode and the second electrode in the planar view,the electronic component driving the functional element, a connectingsection electrically connecting the first electrode to the secondelectrode, the connecting section comprising: a first wiring arrangedbetween the first electrode and the functional element, a second wiringarranged between the first wiring and the functional element, a thirdwiring arranged between the second wiring and the functional element, afirst contact hole connecting the first wiring to the second wiring, anda second contact hole connecting the second wiring to the third wiring,the first contact hole having a portion that does not overlap with thesecond contact hole in the planar view.
 10. The electrical deviceaccording to claim 9, wherein the connecting section is provided atleast along one side of the first substrate.
 11. The electrical deviceaccording to claim 9, wherein the first wiring, the second wiring, thethird wiring, the first contact hole, and the second contact hole areprovided at least along one side of the first substrate.
 12. Theelectrical device according to claim 9, wherein at least a part of theconnecting section is embedded in the first substrate.
 13. Theelectrical device according to claim 9, wherein: the first substratecomprises a first base material and a second base material, the secondbase material arranged between the first base material and thefunctional element, and the first contact hole is formed in the firstbase material, the second contact hole is formed in the second basematerial, and the second wiring is provided between the first basematerial and the second base material.
 14. The electrical deviceaccording to claim 9, wherein the first substrate comprises basematerials which have a flexibility.
 15. The electrical device accordingto claim 9, further comprising: a third electrode arranged between thefunctional element and the second side of the first substrate, whereinthe functional element is an electro-optical element, and an opticalstate of the electro-optical element depends on a voltage between thesecond electrode and the third electrode.
 16. The electrical deviceaccording to claim 9, wherein the connecting section is not overlappingwith the functional element in the planar view.